
Shipping Estimate
USA
- USA
- CAN
- USA
- CAN
Ships within 48 hours · Estimated delivery Jul 6 - Jul 11
For Your Every Summer RSVP, with Code: SUMMER15
Description
XZZ Xinzhizao L23 BGA Reballing Stencil Platform For iPhone A8-A16XZZ Xinzhizao L23 BGA Reballing Stencil Platform For iPhone A8 A16 Motherboard MTK EMMC Qualcomm HUAWEI CPU Welding Repair Tools MAGNETODYNAMIC TINPLANTING PLATFORM Support lP series, Hisilicon series, Qualcomm series, etc BGA maintenance positioning Strong magnetic adsorption Simple operation Precise positioning Imported synthetic stone thermostability Antistatic Automatic precise positioning New magnetic dynamic original positioning Strong magnetic
XZZ Xinzhizao L23 BGA Reballing Stencil Platform For iPhone A8-A16 Motherboard MTK EMMC Qualcomm HUAWEI CPU Welding Repair ToolsMAGNETODYNAMIC TINPLANTING PLATFORM
Support lP series, Hisilicon series, Qualcomm series, etc
BGA maintenance positioning
Strong magnetic adsorption
Simple operation
Precise positioning
Imported synthetic stone
thermostability
Antistatic
Automatic precise
positioning
New magnetic dynamic original positioning
Strong magnetic force automatic clamping, convenient
and flexible, supporting a variety of
CPU maintenance positioning and firm clamping
Magnetomotive force
Automatic and flexible, stable clamping,slide open the card and put the chipaccuratelyolt
can be automatically clamped by magnetic force when it is rele
ased , and the operation is simple and convenient
Shipping Notes
- Free Standard Shipping on $100+ Orders to the USA.
- Except Preorder products are shipped in 48 hours.
- Delivery to the USA:
- Standard Shipping : 3-10 business days
- If time is of the essence, please consider selecting expedited delivery for faster service.
Exchange/Return Notes
- We offer a 30-day return/exchange service after receiving.
- Final sale items are not eligible for returns or exchanges.
- To process your return/exchange, please contact us at [email protected]
- Please click here for more details>>> Return & Exchange Policy